Key Features
– 3D Rendering
– Astrophysics, Chemistry
– Cloud and Virtualization needs
– Cloud Computing
– Compute Intensive Application
1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s
2. Up to 3TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 24 DIMM slots
3. 8 PCI-E 3.0 x16 slots (support up to 8 double width GPU), 2 PCI-E 3.0 x8, 1 PCI-E 2.0 x4
4. Up to 24 Hot-swap 2.5″ drive bays; 8x 2.5″ drives supported natively
5. 2x 10GBase-T LAN ports via Intel C622
6. 8 Hot-swap 92mm RPM cooling fans
7. 2000W (2+2) Redundant Power Supplies Titanium Level (96%+)
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